Information about Solder
A solder is a fusible metal alloy, with a melting point or melting range of 180 to 190 °C (360 to 370 °F), which is melted to join metallic surfaces, especially in the fields of electronics and plumbing, in a process called soldering.
The word solder comes from the Middle English word soudur, via Old French solduree and soulder, from the Latin solidare, meaning '‘to make solid’'. In America the word solder is pronounced with a silent l. Most other countries pronounce the l.
At a eutectic composition, the liquid solder solidifies as a eutectic, which consists of fine grains of nearly pure lead and nearly pure tin phases, but in no way is it an intermetallic, since there are no tin/lead intermetallics, as can be seen from a tin/lead equilibrium diagram. [1]
In plumbing, a higher proportion of lead was used. This had the advantage of making the alloy solidify more slowly, so that it could be wiped over the joint to ensure watertightness. Although lead water pipes were displaced by copper when the significance of lead poisoning began to be fully appreciated, lead solder was still used until the 1980s because it was thought that the amount of lead that could leach into water from the solder was negligible. Since even small amounts of lead have been found detrimental to health, lead in plumbing solder was replaced by copper or antimony, with silver often added, and the proportion of tin was increased (see Lead-free solder below).
In silversmithing or jewelry making, special hard solders are used that will pass assay. They contain a high proportion of the metal being soldered and lead is not used in these alloys. These solders also come in a variety of hardnesses, known as 'enamelling', 'hard', 'medium' and 'easy'. Enamelling solder has a high melting point, close to that of the material itself, to prevent the joint desoldering during firing in the enamelling process. The remaining solder types are used in decreasing order of hardness during the process of making an item, to prevent a previously soldered seam or joint desoldering while soldering a new joint. Easy solder is also often used for repair work for the same reason. Flux or rouge is also used to prevent joints desoldering.
Solder often comes pre-mixed with, or is used with, flux, a reducing agent designed to help remove impurities (specifically oxidised metals) from the points of contact to improve the electrical connection. For convenience, solder is often manufactured as a hollow tube and filled with flux. Most cold solder is soft enough to be rolled and packaged as a coil making for a convenient and compact solder/flux package. The two principal types of flux are acid flux, used for metal mending, and rosin flux, used in electronics, where the corrosiveness of the vapours that arise when acid flux is heated could damage components. Due to concerns over atmospheric pollution and hazardous waste disposal, the electronics industry has been gradually shifting from rosin flux to water-soluble flux, which can be removed with deionised water and detergent, instead of hydrocarbon solvents.
Since solder can occasionally splash (due to the superheated flux inside or from contact with water in the cleaning sponge), it is recommended that safety goggles be worn when soldering. Though small solder splashes on skin are painful, they usually do not cause lasting harm. For large scale work additional protective clothing may be needed.
According to the European Union Waste Electrical and Electronic Equipment Directive (WEEE) and Restriction of Hazardous Substances Directive (RoHS), lead had to be eliminated from electronic systems by July 1 2006, leading to much interest in lead-free solders. These contain tin, copper, silver, and sometimes bismuth, indium, zinc, antimony, and other metals in varying amounts. The lead-free replacements for conventional Sn60/Pb40 solder have higher melting points, requiring re-engineering of most components and materials used in electronic assemblies. Lead-free solder joints may produce mechanically weaker joints depending on service and manufacture conditions, which may lead to a decrease in reliability using such solders. "Tin Whiskers" are another problem with many lead-free solders, where slender crystals of tin slowly grow out of the solder joint. These whiskers can bridge a short circuit years after a device's manufacture.
Shear strength in engineering is a term used to describe the strength of a material or component against the type of yield or structural failure where the material or component fails in shear.
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The word solder comes from the Middle English word soudur, via Old French solduree and soulder, from the Latin solidare, meaning '‘to make solid’'. In America the word solder is pronounced with a silent l. Most other countries pronounce the l.
)
Desoldering a contact and a wire attached with solder.
Lead solder
Tin/lead solders are commercially available with tin concentrations between 5% and 70% by weight. The greater the tin concentration, the greater the solder’s tensile and shear strengths. At the retail level, the two most common alloys are 60/40 Sn/Pb and 63/37 Sn/Pb. The 63/37 ratio is notable in that it is a eutectic mixture, which means:- It has the lowest melting point (183 °C or 361.4 °F) of all the tin/lead alloys; and
- The melting point is truly a point — not a range.
At a eutectic composition, the liquid solder solidifies as a eutectic, which consists of fine grains of nearly pure lead and nearly pure tin phases, but in no way is it an intermetallic, since there are no tin/lead intermetallics, as can be seen from a tin/lead equilibrium diagram. [1]
In plumbing, a higher proportion of lead was used. This had the advantage of making the alloy solidify more slowly, so that it could be wiped over the joint to ensure watertightness. Although lead water pipes were displaced by copper when the significance of lead poisoning began to be fully appreciated, lead solder was still used until the 1980s because it was thought that the amount of lead that could leach into water from the solder was negligible. Since even small amounts of lead have been found detrimental to health, lead in plumbing solder was replaced by copper or antimony, with silver often added, and the proportion of tin was increased (see Lead-free solder below).
Hard solder
As used for brazing, is generally a copper/zinc or copper/silver alloy, and melts at higher temperatures.In silversmithing or jewelry making, special hard solders are used that will pass assay. They contain a high proportion of the metal being soldered and lead is not used in these alloys. These solders also come in a variety of hardnesses, known as 'enamelling', 'hard', 'medium' and 'easy'. Enamelling solder has a high melting point, close to that of the material itself, to prevent the joint desoldering during firing in the enamelling process. The remaining solder types are used in decreasing order of hardness during the process of making an item, to prevent a previously soldered seam or joint desoldering while soldering a new joint. Easy solder is also often used for repair work for the same reason. Flux or rouge is also used to prevent joints desoldering.
Flux core solder
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A tube of multicore electronics solder used for manual soldering - the flux is contained in five cores within the solder itself
Since solder can occasionally splash (due to the superheated flux inside or from contact with water in the cleaning sponge), it is recommended that safety goggles be worn when soldering. Though small solder splashes on skin are painful, they usually do not cause lasting harm. For large scale work additional protective clothing may be needed.
Lead-free solder
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A coil of lead-free solder wire
- SnAgCu solders are used by two thirds of Japanese manufacturers for reflow and wave soldering, and by about ¾ companies for hand soldering.
- SnAg3.0Cu0.5, tin with 3% silver and 0.5% copper, has a melting point of 217 to 220 °C and is predominantly used in Japan. It is the JEITA recommended alloy for wave and reflow soldering, with alternatives SnCu for wave and SnAg and SnZnBi for reflow soldering.
- SnAg3.5Cu0.7 is another commonly used alloy, with melting point of 217-218 °C.
- SnAg3.5Cu0.9, with melting point of 217 °C, is determined by NIST to be truly eutectic.
- SnAg3.8Cu0.7, with melting point 217-218 °C, is preferred by the European IDEALS consortium for reflow soldering.
- SnAg3.8Cu0.7Sb0.25 is preferred by the European IDEALS consortium for wave soldering.
- SnAg3.9Cu0.6, with melting point 217-223 °C, is recommended by the US NEMI consortium for reflow soldering.
- SnCu0.7, with melting point of 227 °C, is a cheap alternative for wave soldering, recommended by the US NEMI consortium.
- SnZn9, with melting point of 199 °C, is a cheaper alloy but is prone to corrosion and oxidation.
- SnZn8Bi3, with melting point of 191-198 °C, is also prone to corrosion and oxidation due to its zinc content.
- SnSb5, tin with 5% of antimony, is the US plumbing industry standard. Its melting point is 232-240 °C. It displays good resistance to thermal fatigue and good shear strength.
- SnAg2.5Cu0.8Sb0.5 melts at 217-225 °C and is patented by AIM alliance.
- SnIn8.0Ag3.5Bi0.5 melts at 197 to 208 °C and is patented by Matsushita/Panasonic.
- SnBi57Ag1 melts at 137-139 °C and is patented by Motorola.
- SnBi58 melts at 138 °C.
- SnIn52 melts at 118 °C and is suitable for the cases where low-temperature soldering is needed.
- Silver provides mechanical strength, but has worse ductility than lead. In absence of lead, it improves resistance to fatigue from thermal cycles.
- Copper lowers the melting point, improves resistance to thermal cycle fatigue, and improves wetting properties of the molten solder. It also slows down the rate of dissolution of copper from the board and part leads in the liquid solder.
- Bismuth significantly lowers the melting point and improves wettability. In presence of lead and tin, bismuth forms crystals of Sn16Pb32Bi52 with melting point of only 95 °C, which diffuses along the grain boundaries and may cause a joint failure at relatively low temperatures. A lead-contaminated high-power part can therefore desolder under load when soldered with a bismuth-containing solder.
- Indium lowers the melting point and improves ductility. In presence of lead it forms a ternary compound that undergoes phase change at 114 °C.
- Zinc lowers the melting point and is low-cost. However it is highly susceptible to corrosion and oxidation in air, therefore zinc-containing alloys are unsuitable for some purposes, e.g. wave soldering, and zinc-containing solder pastes have shorter shelf life than zinc-free ones.
- Antimony is added to increase strength without affecting wettability.
See also
External links
- SolderingGuide.com
- Physical Properties Table: Specialty Alloys and Solders
- Lead-free solder alloys
- Common Solder alloys and their melting ranges
- Database for Solder Properties with Emphasis on New Lead-free Solders Release 4 (MS Word Document format also available)
- Phase Diagrams of different types of solder alloys
A fusible alloy, usually eutectic alloy is capable of being fused, as well as being liquefied by heat.
Sometimes the term "fusible alloy" is used to describe alloys with a melting point below 150°C. Fusible alloys in this sense are used for solder.
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Sometimes the term "fusible alloy" is used to describe alloys with a melting point below 150°C. Fusible alloys in this sense are used for solder.
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An alloy is a homogeneous hybrid of two or more elements, at least one of which is a metal, and where the resulting material has metallic properties. The resulting metallic substance usually has different properties (sometimes substantially different) from those of its components.
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Celsius is, or relates to, the Celsius temperature scale (previously known as the centigrade scale). The degree Celsius (symbol: °C) can refer to a specific temperature on the Celsius scale
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Fahrenheit is a temperature scale named after the German-Dutch physicist Daniel Gabriel Fahrenheit (1686–1736), who proposed it in 1724.
In this scale, the melting point of water is 32 degrees Fahrenheit (written “32 °F”), and the boiling point is
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In this scale, the melting point of water is 32 degrees Fahrenheit (written “32 °F”), and the boiling point is
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Electronics is the study of the flow of charge through various materials and devices such as, semiconductors, resistors, inductors, capacitors, nano-structures, and vacuum tubes. All applications of electronics involve the transmission of power and possibly information.
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piping system in a building with intumescent firestop being installed by an insulator, Vancouver, British Columbia, Canada.]] Plumbing, from the Latin for lead, is the skilled trade of working with pipes, tubing and plumbing fixtures for potable water systems and the
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Soldering is the process in which two metals are joined together by means of a third metal or alloy having a relatively low melting point. Soft soldering is characterized by the value of the melting point of the third metal or alloy, which is below 400°C.
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Middle English}}}
Language codes
ISO 639-1: none
ISO 639-2: enm
ISO 639-3: enm
Middle English is the name given by historical linguistics to the diverse forms of the English language spoken between the Norman invasion of 1066
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Language codes
ISO 639-1: none
ISO 639-2: enm
ISO 639-3: enm
Middle English is the name given by historical linguistics to the diverse forms of the English language spoken between the Norman invasion of 1066
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Old French was the Romance dialect continuum spoken in territories corresponding roughly to the northern half of modern France and parts of modern Belgium and Switzerland from around 1000 to 1300.
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Latin}}}
Official status
Official language of: Vatican City
Used for official purposes, but not spoken in everyday speech
Regulated by: Opus Fundatum Latinitas
Roman Catholic Church
Language codes
ISO 639-1: la
ISO 639-2: lat
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Official status
Official language of: Vatican City
Used for official purposes, but not spoken in everyday speech
Regulated by: Opus Fundatum Latinitas
Roman Catholic Church
Language codes
ISO 639-1: la
ISO 639-2: lat
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Motto
"In God We Trust" (since 1956)
"E Pluribus Unum" ("From Many, One"; Latin, traditional)
Anthem
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"In God We Trust" (since 1956)
"E Pluribus Unum" ("From Many, One"; Latin, traditional)
Anthem
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TIN may refer to:
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- Tax identification number
- Triangulated irregular network, a data structure used in a geographic information systems
See also
- Tin
This article is about the metallic chemical element.
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2
(Amphoteric oxide)
Electronegativity 2.33 (scale Pauling)
Ionization energies
(more) 1st: 715.6 kJmol−1
2nd: 1450.5 kJmol−1
3rd: 3081.
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(Amphoteric oxide)
Electronegativity 2.33 (scale Pauling)
Ionization energies
(more) 1st: 715.6 kJmol−1
2nd: 1450.5 kJmol−1
3rd: 3081.
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Tensile strength , or measures the force required to pull something such as rope, wire, or a structural beam to the point where it breaks.
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Explanation
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For the shear strength of soil, see .
Shear strength in engineering is a term used to describe the strength of a material or component against the type of yield or structural failure where the material or component fails in shear.
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TIN may refer to:
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- Tax identification number
- Triangulated irregular network, a data structure used in a geographic information systems
See also
- Tin
This article is about the metallic chemical element.
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2
(Amphoteric oxide)
Electronegativity 2.33 (scale Pauling)
Ionization energies
(more) 1st: 715.6 kJmol−1
2nd: 1450.5 kJmol−1
3rd: 3081.
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(Amphoteric oxide)
Electronegativity 2.33 (scale Pauling)
Ionization energies
(more) 1st: 715.6 kJmol−1
2nd: 1450.5 kJmol−1
3rd: 3081.
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eutectic or eutectic mixture is a mixture at such proportions that the melting point is as low as possible, and that furthermore all the constituents crystallize simultaneously at this temperature from molten liquid solution.
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Lead poisoning
Classification & external resources
ICD-10 T 56.0
ICD-9 984.9
Lead poisoning is a medical condition, also known as saturnism, plumbism or painter's colic, caused by increased blood lead levels.
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Classification & external resources
ICD-10 T 56.0
ICD-9 984.9
Lead poisoning is a medical condition, also known as saturnism, plumbism or painter's colic, caused by increased blood lead levels.
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2, 1
(mildly basic oxide)
Electronegativity 1.90 (Pauling scale)
Ionization energies
(more) 1st: 745.5 kJmol−1
2nd: 1957.9 kJmol−1
3rd: 3666 kJmol−1
Atomic radius 135 pm
Atomic radius (calc.
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(mildly basic oxide)
Electronegativity 1.90 (Pauling scale)
Ionization energies
(more) 1st: 745.5 kJmol−1
2nd: 1957.9 kJmol−1
3rd: 3666 kJmol−1
Atomic radius 135 pm
Atomic radius (calc.
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3, 5
Electronegativity 2.05 (scale Pauling)
Ionization energies
(more) 1st: 834 kJmol−1
2nd: 1594.9 kJmol−1
3rd: 2440 kJmol−1
Atomic radius 145 pm
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Electronegativity 2.05 (scale Pauling)
Ionization energies
(more) 1st: 834 kJmol−1
2nd: 1594.9 kJmol−1
3rd: 2440 kJmol−1
Atomic radius 145 pm
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Silver (IPA: /ˈsɪlvə(ɹ)/) is a chemical element with the symbol Ag (Latin: argentum) and atomic number 47.
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Brazing is a joining process whereby a non-ferrous filler metal or alloy is heated to melting temperature above 450°C (842°F), or, by the traditional definition that has been used in the United States, above 800°F (425)°C and distributed between two or more close-fitting parts by
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Zinc (IPA: /ˈzɪŋk/, from German: Zink) is a chemical element in the periodic table that has the symbol Zn and atomic number 30.
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An assay is a procedure where a property or concentration of an analyte is measured.
There are numerous types of assays, such as an antigen capture assay, bioassay, competitive protein binding assay, crude oil assay, four-point assay,
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There are numerous types of assays, such as an antigen capture assay, bioassay, competitive protein binding assay, crude oil assay, four-point assay,
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The introduction to this article may be too long. Please help improve the introduction by moving some material from it into the body of the article according to the suggestions at Wikipedia's .
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desoldering is the removal of solder and components from a circuit for troubleshooting, repair purposes and to salvage components. Electronic components are often mounted on a circuit board and it is usually desirable to avoid damaging the circuit board, surrounding components, and
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flux is a substance which facilitates soldering, brazing, and welding by chemically cleaning the metals to be joined. Common fluxes are: ammonium chloride or rosin for soldering tin; hydrochloric acid and zinc chloride for soldering galvanized iron (and other zinc surfaces); and
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Redox (shorthand for reduction/oxidation reaction) describes all chemical reactions in which atoms have their oxidation number (oxidation state) changed.
This can be either a simple redox process such as the oxidation of carbon to yield carbon dioxide, or the
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This can be either a simple redox process such as the oxidation of carbon to yield carbon dioxide, or the
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Deionized water (DI water or de-ionized water; also spelled deionised water, see spelling differences) is water that lacks ions, such as cations from sodium, calcium, iron, copper and anions such as chloride and bromide.
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